Inventor of the Year Award for U.S. Patent No. 6,709,562 – relating to copper interconnect technology for semiconductor integrated circuit chips.
Award Recipients:
C.E. Uzoh
K-H Wong
P.C. Andricacos
H. Deligianni
J.O. Dukovic
D.C. Edelstein
W.J. Horkans
C-K Hu
J.L. Hurd
K.P. Rodbell